600x Better Thermal Dissipation.
Minimal Cooling Requirements.
Longer Lifetime & Reliability.
Highest Optical Power Output.
With proprietary Low Temperature Bonding Technology (LTBT), Flip Chip Opto bonds the 3-Pad Flip Chip LED onto the Pillar MCPCB surface where the N- and P- pads are electrically coupled with the Pillar MCPCB’s Cathode and Anode, respectively, and the T-pad is thermally coupled to the metal core of the Pillar MCPCB through the pillar structure.
Flip Chip Opto’s COB enables direct thermal dissipation from the Flip Chip LEDs to the metal core through the pillar structure, while the conventional COB must diffuse its thermal energy through the thermal resistant insulation layer between the Flip Chip LED and the metal core.
Thermal decay is a natural characteristic for LEDs, as the junction (Tj) rises due to the increase of the driving current which results in an efficacy decrease (lm/w). Flip Chip Opto’s patented technology delivers vastly superior thermal dissipation, thereby minimizing Tj increase and effectively reducing thermal decay to allow increases in the driving current. Longer lifespan in the same product class is achieved through reduced thermal decay.
Highest Optical Power Output
We proudly offer COBs with industry leading power output: our products range from 100W to 2400W. Our high power LEDs ensure the most energy savings from a single-source.
Flip Chip Opto has provided COBs to a wide range of applications across many industries and have supplied luminaire systems to ports, stadiums, ski resorts, botanical gardens, factories, and convention centers. Please contact us if you have a wattage requirement outside of our output range. We have the manufacturing capabilities to produce powerful, high-efficiency LEDs at any power output.
Minimal Cooling Requirements
High output power COBs typically require large cooling systems or heatsinks to prevent overheating malfunctions. These products often collect too much heat in the insulation layer of the LED, causing a decrease in light output and lifetime. Our high performance LED modules are made with the patented flip chip and proprietary low temperature bonding, thus allowing for rapid heat dissipation from the LED to the metal PCB.
Flip Chip Opto’s COBs have less chance of thermal decay over time and can use smaller heatsinks to transfer heat. This makes our LEDs more versatile in their applications and convenient for lighting system design.
Extreme Reliability & Durability
All of our COBs are tested under rigorous reliability and endurance examination. We’ve tested all of our products to surpass 1,000 cycles of thermal shock and have proven longevity even in the most rugged environments.
Best Thermal Dissipation
Flip Chip Opto’s core technologies, the patented 3-Pad Flip Chip LED and Pillar MCPCB, are both invented and developed in the Silicon Valley. They are designed to coordinate with each other as a Chip on Board (COB) module in order to optimize the thermal dissipation through its unique thermal structures and therefore minimize the thermal resistance between the 3-Pad Flip Chip LED junctions and the bottom of the Pillar MCPCB.